SUBSTRATE PROCESSOR

PROBLEM TO BE SOLVED: To improve throughput, without raising cost or enlarging a processor. SOLUTION: A substrate processor is provided with an application device 1, having an application part 12 for applying a photosensitive material to a substrate 3 as the object of processing, a cooling part 14 f...

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Bibliographische Detailangaben
1. Verfasser:	HARA NORIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve throughput, without raising cost or enlarging a processor. SOLUTION: A substrate processor is provided with an application device 1, having an application part 12 for applying a photosensitive material to a substrate 3 as the object of processing, a cooling part 14 for cooling the substrate 3 to which the photosensitive material is applied and a buffer 152 which temporarily stores the cooled substrate and an exposure device 2 having an exposure part 23 for transferring the image of the pattern of a mask on the substrate 3 and a transfer part 22 for receiving the substrate 3 from the buffer 152 and transferring it to the exposure part 23. The transfer part 22 and the exposure part 23 in the aligner 2 and the buffer 152 and the cooling part 14 in the application device 1 are installed in the same air-conditioning chamber 5.