FILM DEPOSITION METHOD AND FILM DEPOSITION SYSTEM

PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition system capable of deposition oxidized films or nitrided films of high quality. SOLUTION: This system has a vacuum vessel 20 to be arranged with substrates 13, 14 and 15 at the inside, a target 10 of the material composed of one part of elements among elements composing required thin films, a magnet part 16 forming the desired magnetron field on the surface of the target 10 and mechanism 21, 22, 23 and 24 introducing gas into the vacuum vessel, wherein film deposition and non-film deposition means 17 in which a film deposition period in which thin films are deposited on the substrates and a non-deposition period in which thin films are not deposited are alternately repeated is provided, in this film deposition and non-film deposition means, as the film deposition period, the time for which the thickness of the film to be deposited during the film deposition period for one time is made into the one of a naturally oxidized film or a naturally nitrided film or less is taken. and, as the non-film deposition period, the time required for allowing the composition of the thin film deposited during the film deposition period to reach the stoichiometric one is taken. In this way, the target material and oxygen or nitrogen are brought into reaction in the vacuum vessel 20, and thin films are deposited on the substrates to deposit oxidized films or nitrided films.