SUBSTRATE TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which uniformize the flow of the treatment solution and allows the uniform treatment on substrates on the bottom surface of a treatment tank. SOLUTION: An overflow unit to allow the plating solution 37 to overflow from a whole peripher...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SONODA HARUKI, MORITO TAISHIN, TACHIHABA YOSHITO, NOBATA HIROYOSHI, OTSUBO TETSURO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which uniformize the flow of the treatment solution and allows the uniform treatment on substrates on the bottom surface of a treatment tank. SOLUTION: An overflow unit to allow the plating solution 37 to overflow from a whole periphery of an upper portion of a side surface is provided on the side surface of the treatment tank 31, a slit 47 is provided in a lower portion of the side surface of the treatment tank 31, and the plating solution 37 is discharged from the whole periphery of the side surface in the vicinity of a semi-conductor wafer 33 via the slit 47.