EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in normal-temperature storage characteristics and reliability of moisture resistance and is adaptable to insertion mounting and surface mounting. SOLUTION: This resin composition essentially comp...

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Bibliographische Detailangaben
1. Verfasser:	OKI HIROMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in normal-temperature storage characteristics and reliability of moisture resistance and is adaptable to insertion mounting and surface mounting. SOLUTION: This resin composition essentially comprises (A) an epoxy resin; (B) a phenol resin; (C) a molecular compound which is a molecular associate of a tetrasubstituted phosphonium (X), a compound (Y) having at least two phenolic hydroxyl groups, and a conjugated base of the compound (Y) having at least two phenolic hydroxyl groups provided the conjugated base is a phenoxide type compound formed by removing one hydrogen atom from the compound (Y) having at least two phenolic hydroxyl groups; (D) an organic phosphine; and (E) an inorganic filler provided that the equivalent ratio of epoxy groups of the epoxy resin to phenolic hydroxyl groups of the phenol resin is 0.5-2 and that the amount of the inorganic filler (E) compounded is 200-2,400 pts.wt. based on 100 pts.wt. the sum of the epoxy resin and the phenol resin.