FLEXIBLE PRINTED BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a flexible printed board (an FPC) in which adhesives need not be used. SOLUTION: Adhesives need not be used and a manufacturing process is simplified by the flexible printed board 100 in which copper circuit sheets 110 are buried directly between extrusion-molded res...

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Bibliographische Detailangaben
Hauptverfasser:	IMAI TAKAYUKI, TANABE NOBUO, ARAI MASAHIKO, JUMONJI SADAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible printed board (an FPC) in which adhesives need not be used. SOLUTION: Adhesives need not be used and a manufacturing process is simplified by the flexible printed board 100 in which copper circuit sheets 110 are buried directly between extrusion-molded resin films 120, 130, to which the sheets 110 are thermocompression-bonded.