FORMING METHOD OF BUMP ON BARE CHIP IC

FORMING METHOD OF BUMP ON BARE CHIP IC

PROBLEM TO BE SOLVED: To prevent reliability of connection of a bare chip IC with terminals from being reduced, even when those with small pitches between pads and small size for the pads are included in the terminals of the IC. SOLUTION: Gold bumps for mounting to pads on the bare chip IC are forme...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MURAMATSU MORIO, KAWAMATA TETSUJI, YAHAGI SATORU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent reliability of connection of a bare chip IC with terminals from being reduced, even when those with small pitches between pads and small size for the pads are included in the terminals of the IC. SOLUTION: Gold bumps for mounting to pads on the bare chip IC are formed in pad sizes to match with the bumps on the pads.