SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUBSTRATE

PROBLEM TO BE SOLVED: To enhance densities of wiring layers and vias and reliability and to reduce a cost in a semiconductor device having a constitution for mounting a semiconductor element on a substrate. SOLUTION: The semiconductor device comprises a flexible multilayer substrates 12A of a consti...

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Bibliographische Detailangaben
Hauptverfasser: KANWA MASARU, IIJIMA MASANORI, MORIOKA MUNETOMO, UENO SEIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To enhance densities of wiring layers and vias and reliability and to reduce a cost in a semiconductor device having a constitution for mounting a semiconductor element on a substrate. SOLUTION: The semiconductor device comprises a flexible multilayer substrates 12A of a constitution for alternately laminating organic insulating substrate layers 15A to 15C and film-like adhesive layers 16A to 16C, and for connecting wiring layers 17A to 17C formed in the laminated layers between the layers by using vias 18A to 18C, and a semiconductor element 11 mounted on the board 12A. In this case, the device further comprises via holes 23 formed by penetrating the vias 18A to 18C through the layer 15A to 15C an the layers 16A to 16C, and metal via materials 16 arranged in the via holes 23. Further, the materials 26 in the holes 23 are formed of the same material.