MULTILAYER INTERCONNECTION BOARD

PROBLEM TO BE SOLVED: To provide a multilayer interconnection board superior in heat- resistance. SOLUTION: An insulating layer is formed is formed on an inner-layer circuit board, over which an outer-layer circuit is formed. A character, number, and mark of conductor are comprised on the surface of...

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Bibliographische Detailangaben
Hauptverfasser:	IWASAKI YORIO, WATANABE SETSUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multilayer interconnection board superior in heat- resistance. SOLUTION: An insulating layer is formed is formed on an inner-layer circuit board, over which an outer-layer circuit is formed. A character, number, and mark of conductor are comprised on the surface of inner-layer circuit board, with an independent void in the character, number, and mark being filled with a conductor, or an independent void provided by cutting off a part of the charter, number, and a mark communicated with a surrounding part comprising no conductor.