METHOD OF MANUFACTURING MULTILAYERED BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing an asymmetric, less-warped multilayered board. SOLUTION: In this method of manufacturing the asymmetric multilayered board, in which a difference occurs between the amounts of expansion and contraction of prepregs put on and under each inner...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	TAKAMATSU SHOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing an asymmetric, less-warped multilayered board. SOLUTION: In this method of manufacturing the asymmetric multilayered board, in which a difference occurs between the amounts of expansion and contraction of prepregs put on and under each inner-layer circuit board, panel boards having different coefficients of thermal expansion are respectively arranged, on and under multiple laminating materials at laminating of the materials upon another.