SEMICONDUCTOR DEVICE AND IC CARD

PROBLEM TO BE SOLVED: To provide a semiconductor device on which a plurality of chips are mounted in the same wiring board for easily combining chips having different functions, and for assembling chips having the same function without the inversion (mirror state) of the circuit configuration. SOLUT...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOSOMI HIDEKAZU, ARITA AKIRA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device on which a plurality of chips are mounted in the same wiring board for easily combining chips having different functions, and for assembling chips having the same function without the inversion (mirror state) of the circuit configuration. SOLUTION: A wiring board 1 on one face of which a wiring layer is formed is provided with a first electrode pad ground and a second electrode pad group formed on a wiring layer 3 on the wiring board, a through-hole 11 formed in the wiring board just under the second electrode pad, a first chip 2 connected with the first electrode pad group, and a second chip 2' connected with the second electrode pad group. In this case, the first electrode pad group and the second electrode pad group are arranged so as to be shifted from each other on the face on which the wiring layer is formed of the wiring board. Thus, it is possible to easily combine chips having different functions in the same wiring board, and to assembly the chips having the same function without the inversion (mirror state) of the circuit configuration.