LITHOGRAPHY SYSTEM IN SEMICONDUCTOR MANUFACTURING

PROBLEM TO BE SOLVED: To provide a lithography system, installed in an area smaller than that in the conventional case in a semiconductor manufacturing step and suitably and easily used, when a new process is introduced. SOLUTION: This lithography system includes a first port, a second port, a coati...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHO KISUN, KANG HEE YOUNG, KIMU DONHO
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a lithography system, installed in an area smaller than that in the conventional case in a semiconductor manufacturing step and suitably and easily used, when a new process is introduced. SOLUTION: This lithography system includes a first port, a second port, a coating means, and a development means. The first and second ports function as a coming and going opening of a substrate, and the second port is provided at a given distance from the first port. The coating means is provided for joining the first port and the second port, and the application step is carried out, while the substrate is transported between the first port and the second port. A development means is provided in an overlapped on the coating means that joins the first port and the second port. Development steps are carried out during the transfer of the substrate between the first and second ports. The operation of the equipment can be kept steadily, and the lithography system can be installed in an area smaller than that in the conventional system.