METHOD AND DEVICE FOR POLISHING AND POLISHING CARRIER USED FOR IT

PROBLEM TO BE SOLVED: To provide a method and device for polishing both front and back faces of a work held inside a work holding hole while rotating and revolving a polishing carrier between an upper surface plate and a lower surface plate to prevent excessive contact resistance of the work with the upper/lower surface plates and having no parsibility of breaking, chipping and damaging for the work such as a very thin wafer in particular. SOLUTION: When the polishing carrier 10 rotates/revolves between the upper/lower surface plates 3 and 4, only one edge 11a of the work holding hole 11 is moved in/out from inner/outer circumference of the upper/lower surface plates by a fixed distance to decrease rotation angle of the polishing carrier from the edge coming out of the inner/outer circumference to coming in again. The rectangle work holding hole is formed such that a straight radial line L1 passing through the center of the hole and one side S1 of the work holding hole adjacent to the edge coming in/out of the inner/outer circumference of the upper/lower surface plates cross each other with a fixed angle θ within minimum and maximum angles determined by a length of side S2 adjacent to the edge that follows it and by that of side S1 that precedes it except for 90 deg..