CERAMIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a ceramic circuit board which is superior in heat cycle resistance and has a high reliability. SOLUTION: The ceramic circuit board has a metal plate containing Al as a main component, the metal plate is bonded to a ceramic board through an Al alloy foil used as an ad...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO ISAO, NONOGAKI RYOZO, OGATA YOICHI, UTO MANABU, IBUKIYAMA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramic circuit board which is superior in heat cycle resistance and has a high reliability. SOLUTION: The ceramic circuit board has a metal plate containing Al as a main component, the metal plate is bonded to a ceramic board through an Al alloy foil used as an adhesive material, and the Al alloy foil is 10 μm or more thick and contains Cu and Mg. The Cu concentration in the Al bonding layer near the interface of the ceramic board is 3 mass % or less after bonding.