INTEGRATED CIRCUIT ASSEMBLY

INTEGRATED CIRCUIT ASSEMBLY

PROBLEM TO BE SOLVED: To provide an integrated circuit assembly of chips formed of two or more non-interchangeable IC processes capable of reducing the cost and hardly affected by the influences of an inductance and an EMI and suppressing its size. SOLUTION: A daughter die 22 stacked on a mother die...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KELLY MICHAEL G, CROFT DANIEL I, BLEDSOE JAMES DAREN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an integrated circuit assembly of chips formed of two or more non-interchangeable IC processes capable of reducing the cost and hardly affected by the influences of an inductance and an EMI and suppressing its size. SOLUTION: A daughter die 22 stacked on a mother die 14 is provided on the integrated circuit assembly, circuit layers 32, 50 of the dies are opposed to each other, and the dies are connected with a conductive layer or a solder bump.