RESIN SEALED SEMICONDUCTOR DEVICE AND PRODUCING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a high-reliability and low-cost semiconductor device by reducing the size of a BGA semiconductor device and improving the connectivity of a wiring pattern. SOLUTION: A semiconductor ship 15 is packaged on a frame substrate composed of metal foil having a wiring pattern 14 formed by electrolytic plating on an upper surface and after the semiconductor chip 15 is sealed with a mold resin 17, the metal foil is etched from a lower surface and formed as a land 13 connected to the wiring pattern. Since the semiconductor chip 15 is packaged on the wiring pattern 14 having satisfactory connectivity, the reliability of wiring is improved, the entire thickness is reduced, the degree of freedom is applied to the location of external terminals 18 and it is possible to meet the demand for size reduction of the semiconductor device.