COF SUBSTRATE FOR USE IN CONNECTION OF ELECTRICAL APPARATUS

PROBLEM TO BE SOLVED: To solve the problems in prior art where the film did not easily bend at a desired portion, when a COF substrate connected and fixed to an electrical apparatus is bent 180 deg. to downsize, i.e., it was difficult to bend the insulative film at a short distance from the connecti...

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1. Verfasser: SHIROKURA HIDEAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To solve the problems in prior art where the film did not easily bend at a desired portion, when a COF substrate connected and fixed to an electrical apparatus is bent 180 deg. to downsize, i.e., it was difficult to bend the insulative film at a short distance from the connection end of the electrical apparatus and the film. SOLUTION: A COF substrate is connected and fixed to an electrical apparatus in one body, electrical components are connected to and integrated with the COF substrate, the COF substrate has a connector projecting to the end of one side of an insulating film, the COF substrate has bend guide holes and bending guide notches at portions, where no conductive layer of the electric apparatus is provided, and the plurality of bend guide holes and/or the plurality of bend guide notches form one line.