METHOD AND APPARATUS FOR FORMING FILM

PROBLEM TO BE SOLVED: To provide an apparatus for forming a uniform resist film even at the outer edge of a substrate by regulating a coating amount on the edge of the substrate. SOLUTION: A base 6 for mounting a wafer W is linearly movable along a rail 63. A nozzle 65 for discharging a resist liqui...

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Bibliographische Detailangaben
Hauptverfasser:	EZAKI YUKIHIKO, MORIKAWA SUKEAKI, KOBAYASHI SHINJI, KITANO TAKAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an apparatus for forming a uniform resist film even at the outer edge of a substrate by regulating a coating amount on the edge of the substrate. SOLUTION: A base 6 for mounting a wafer W is linearly movable along a rail 63. A nozzle 65 for discharging a resist liquid is movable along the rail 68. Suction nozzles 72, 73 are respectively provided at two mask members 70, 71. When he nozzle 65 arrives at the outer edge of the wafer W discharging a resist liquid, the liquid before arriving at the surface of the wafer W is sucked by nozzles 72, 73 immediately after discharging.