CERAMICS CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a ceramics circuit board that can be applied to applications requiring high reliability. SOLUTION: In the ceramics circuit board, a metal plate that mainly consists of aluminum is bonded to at least one main surface of a ceramics substrate, and Mg is unevenly distrib...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO ISAO, OGATA YOICHI, UTO MANABU, NONOGAKI RYOZO, IBUKIYAMA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramics circuit board that can be applied to applications requiring high reliability. SOLUTION: In the ceramics circuit board, a metal plate that mainly consists of aluminum is bonded to at least one main surface of a ceramics substrate, and Mg is unevenly distributed at the junction interface between the metal plate and a brazing material layer or near the junction interface.