PRINTING METHOD OF CONDUCTOR
PROBLEM TO BE SOLVED: To provide a printing method of conductor, which enables formation of a finer, intact conductor pattern free of defects such as cavities and bubbles at a relatively low temperature. SOLUTION: This method includes a process where a resist 12 is provided on the surface of a subst...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a printing method of conductor, which enables formation of a finer, intact conductor pattern free of defects such as cavities and bubbles at a relatively low temperature. SOLUTION: This method includes a process where a resist 12 is provided on the surface of a substrate 10 along the pattern, a process where an ultrafine particles solution 20, which is made by dispersing ultrafine particles in a prescribed solvent, is made to contact with the whole surfaces of the substrate 10 and resist 12, and they are dried and baked, then the whole surfaces of substrate 10 and resist 12 are coated with a metal film 22, a process where a conductor 24 is embedded through plating into a recess 14 walled by the resist 12, and a process where unwanted portions of the conductor 24 and resist 12 are removed to obtain a pattern made of the conductor 24 embedded in the recess 14. |
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