METHOD FOR COATING BONDING PASTE

PROBLEM TO BE SOLVED: To provide a method for coating bonding paste which is better spread at a lower side of a chip on bonding, without uneven distribution of the paste. SOLUTION: In this method for coating bonding paste, the bonding paste is coated at a chip-mounting position of a substrate. The paste is coated, in such a manner that first coating widths WA1 and WB1 at ends E1 and E2 of coating lines LA and LB radially extending from a center O of a coating region 6a are determined wider that second coating widths WA2 and WB2 of the coating lines LA and LB at middle points between the center O and the ends E1 and E2. Thus, coating amount of the paste is distributed in consideration of spreading condition on bonding, resulting in prevention of the paste from uneven distribution.