METHOD OF MANUFACTURING SEMICONDUCTOR WAFER INCLUDING ANNEALING AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor wafer and a semiconductor device which includes annealing, a process of curing defects on the semiconductor wafer or on the surface of a semiconductor device to reduce a surface roughness caused by the defects. SOLUTION: A se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BOKU SEIU, SO GENSHO, BOKU KEIEN, BOKU TAISHO, RI KANSHIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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