CONDUCTIVE BONDING AGENT BY CREAM SOLDER MIXING AND BONDING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To solve the conventional problem that a conducive bonding agent has bonding deficiency caused by humidity with an inexpensive conductive bonding agent. SOLUTION: This conductive bonding agent is composed by mixing a conductive bonding agent of a conductive filler and a resin b...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMIZU KOJI, ASAMI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CONDUCTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the conventional problem that a conducive bonding agent has bonding deficiency caused by humidity with an inexpensive conductive bonding agent. SOLUTION: This conductive bonding agent is composed by mixing a conductive bonding agent of a conductive filler and a resin binder with a cream solder or a zinc-free cream solder using a resin based flux as the base. It uses at least one kind out of silver, nickel and copper as conductive filler, filler consisting of both or either one of silver filler and a tin alloy filler as the conductive filler, and uses a filler consisting of a tin-bismuth alloy or/and a tin-silver-bismuth alloy as the filler of the zinc-free cream solder.