DIE FOR MANUFACTURING SEMICONDUCTOR APPARATUS
PROBLEM TO BE SOLVED: To provide a die capable of maintaining excellent wear resistance with a diamond sintered body and a CBN sintered body and not causing breaking in a die used together with a punch in a package manufacturing process of a semiconductor apparatus. SOLUTION: By forming the section...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a die capable of maintaining excellent wear resistance with a diamond sintered body and a CBN sintered body and not causing breaking in a die used together with a punch in a package manufacturing process of a semiconductor apparatus. SOLUTION: By forming the section of >=0.1 mm depth in the thickness direction from the upper face and of |
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