DIE FOR MANUFACTURING SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To provide a die capable of maintaining excellent wear resistance with a diamond sintered body and a CBN sintered body and not causing breaking in a die used together with a punch in a package manufacturing process of a semiconductor apparatus. SOLUTION: By forming the section...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAZAKI KENICHIRO, HIRASHIMA TEIJI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a die capable of maintaining excellent wear resistance with a diamond sintered body and a CBN sintered body and not causing breaking in a die used together with a punch in a package manufacturing process of a semiconductor apparatus. SOLUTION: By forming the section of >=0.1 mm depth in the thickness direction from the upper face and of