MANUFACTURING METHOD FOR PRINTED WIRING BOARD WITH PHOTOSENSITIZED POLYIMIDE

PROBLEM TO BE SOLVED: To settle the problem where, related to a polyimide-fitted copper foil which is worked as a flexible wiring board, an etching resist as well as laser technology is required, when opening a via hole, etc., with a polyimide film as a substrate for multilayer or other application....

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Bibliographische Detailangaben
Hauptverfasser:	MATSUO KOZO, UEMITSU TATSUYOSHI, NAKANO TSUNETOMO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To settle the problem where, related to a polyimide-fitted copper foil which is worked as a flexible wiring board, an etching resist as well as laser technology is required, when opening a via hole, etc., with a polyimide film as a substrate for multilayer or other application. SOLUTION: With the use of a photosensitized polyimide instead of polyimide, a via hole, etc., required for multi layer or other application is provided by exposure and development through a mask with no etching dry film pasted nor laser process.