SEMICONDUCTOR MODULE AND INVERTER DEVICE USING THE SAME
PROBLEM TO BE SOLVED: To obtain a semiconductor module of which mechanical reliability and electrical reliability are improved. SOLUTION: The height of an auxiliary terminal is made at least 80% of module height, and the difference in height between the two is made at least 5 mm. Thereby, mechanical...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To obtain a semiconductor module of which mechanical reliability and electrical reliability are improved. SOLUTION: The height of an auxiliary terminal is made at least 80% of module height, and the difference in height between the two is made at least 5 mm. Thereby, mechanical rigidity and insulation property of a semiconductor module are improved. |
---|