SEMICONDUCTOR MODULE AND INVERTER DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To obtain a semiconductor module of which mechanical reliability and electrical reliability are improved. SOLUTION: The height of an auxiliary terminal is made at least 80% of module height, and the difference in height between the two is made at least 5 mm. Thereby, mechanical...

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Hauptverfasser: KUSHIMA TADAO, NONOYAMA SHIGEHARU, TANAKA AKIRA, KOIKE YOSHIHIKO, SAITO RYUICHI, SHIMIZU HIDEO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a semiconductor module of which mechanical reliability and electrical reliability are improved. SOLUTION: The height of an auxiliary terminal is made at least 80% of module height, and the difference in height between the two is made at least 5 mm. Thereby, mechanical rigidity and insulation property of a semiconductor module are improved.