COATING DEVICE AND METHOD OF BONDING PASTE

PROBLEM TO BE SOLVED: To providing a coating device of bonding paste that has improved operability and can obtain improved coating quality, and its coating method. SOLUTION: In the coating method of bonding paste for drawing and coating the bonding paste by moving a coating nozzle while discharging...

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Bibliographische Detailangaben
1. Verfasser:	OSONO MITSURU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To providing a coating device of bonding paste that has improved operability and can obtain improved coating quality, and its coating method. SOLUTION: In the coating method of bonding paste for drawing and coating the bonding paste by moving a coating nozzle while discharging the bonding paste from the coating nozzle at a position where the chip of a substrate is mounted, a drawing pattern for indicating the pattern of a coating line in a coating area is displayed on a screen 60 when setting the drawing pattern used for controlling a traveling means for moving the coating nozzle, and drawing setting data for indicating the relative relationship between chip sizes Lx and Ly and each drawing element is inputted for each drawing element (diagonal cross element E1, horizontal line element E2, and vertical line element E3) for composing the drawing pattern, thus editing the drawing pattern.