COPPER ELECTROPLATING EQUIPMENT AND COPPER PLATING PROCESS USING THE SAME

PROBLEM TO BE SOLVED: To provide a good plated coating film having a smooth surface and no pits by preventing copper sulfate concentration in the copper sulfate plating solution from being increased and inhibiting anode slime from being formed, in a copper plating process using a copper sulfate plating solution. SOLUTION: Relating to this plating equipment, an anode chamber within which a copper anode and an insoluble anode are contained is arranged in a plating tank containing a copper sulfate plating solution and inside the plating tank and also, a cation exchange membrane for isolating the anode chamber from the plating solution, is fitted to the outer wall of the anode chamber. This plating process if performed while adjusting the current distribution ratio with respect to the both anodes to such a value that the copper concentration can be maintained at a substantially constant level, wherein as the copper anode, electric copper or oxygen-free copper can be used.