RESIN-SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To support a semiconductor chip stably by supporting a die pad at four spots, in place of ordinary one-point supporting. SOLUTION: Since supporting spots for semiconductor chip 35 are four in number, and approach the end parts of the semiconductor chip 35. By forming four chip-supporting parts 34 of approximately the same height by press working using a lead frame as original material, so as to protrude from the exposed fundamental part 33 of a die pad 32, and supporting the semiconductor chip 35 by the supporting parts 34, a mounted posture of the semiconductor chip 35 is stabilizes, and a possibility of generation of inconvenience in a manufacturing process is diminished. Besides, the semiconductor chip 35 can be thinned, and consequently it becomes possible to thin a semiconductor device, since rigidity which is required by the semiconductor chip 35 becomes smaller by the increase of the supporting points.