COMPONENT FOR INSULATIVELY FIXING PROBE

PROBLEM TO BE SOLVED: To provide a component for insulatively fixing a probe card having a small thermal expansion, which is slightly different from that of a silicon wafer, excellent strength at a high temperature and excellent workability. SOLUTION: A component 2 for insulatively fixing a probe 6...

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Bibliographische Detailangaben
Hauptverfasser:	JOJIMA MASAAKI, IWANAGA KATSUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a component for insulatively fixing a probe card having a small thermal expansion, which is slightly different from that of a silicon wafer, excellent strength at a high temperature and excellent workability. SOLUTION: A component 2 for insulatively fixing a probe 6 incorporated in a probe card 100 used for a chip test of a silicon wafer 12 formed into semiconductor chips is manufactured using mullite ceramic. The contents of Al2O3 and SiO2 in the mullite ceramic is 70-73 weight % and 27-30 weight %, respectively. The total weight of these is 98 weight % or more. The volume density is 3.0 g/cm3 or more. The thermal expansion coefficient is 3.0-4.5×10-61/ deg.C.