FLEXIBLE TAPE FOR FORMING FINE PATTERN AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a film base IC mounted board which can utilize the prior art TAB tape manufacturing line and has an ultrafine pitch of 50μm or less, particularly, a flexible tape which can be bonded with outer leads by bending TAB system after mounting an LCD driven IC. SOLUTION: Th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NAGAI KAZUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film base IC mounted board which can utilize the prior art TAB tape manufacturing line and has an ultrafine pitch of 50μm or less, particularly, a flexible tape which can be bonded with outer leads by bending TAB system after mounting an LCD driven IC. SOLUTION: This bending tape consists of a first film layer (a) and a second film layer (c) with an adhesive layer (b) in between: the second film layer is surfaced with a metal layer (d), and the first film layer (a) and the adhesive layer (b) can easily be released integrally from the rear of the second film layer (c).