SEMICONDUCTOR DEVICE AND FULL-WAVE RECTIFICATON DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein resistance to thermal fatigue of a brazing filler metal layer is improved and stable and safe operation is enabled, and a full-wave rectification device using the semiconductor device. SOLUTION: A semiconductor chip has a first main surface and a second main surface which are parallel with each other, and an end surface in the outer peripheral part. The first main surface forms an acute angle with the end surface. The second main surface forms an obtuse angle with the end surface. The first main surface forms a right angle or an obtuse angle with the outer peripheral end surface of a first brazing filler metal layer arranged continuously to the first main surface. The second main surface forms a right angle or an acute angle with the outer peripheral end surface of a second brazing material layer arranged continuously to the second main surface.