SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONTACT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with a self-aligned contact and a method of manufacturing the same. SOLUTION: A semiconductor device equipped with a self-aligned contact comprises a conductive region 31, a conductive line 34, and a contact plug 44 which electrically...

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Bibliographische Detailangaben
Hauptverfasser: BOKU SHUNSHU, KYO GENZAI, KIN JINSEI, RI JUGEN
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device equipped with a self-aligned contact and a method of manufacturing the same. SOLUTION: A semiconductor device equipped with a self-aligned contact comprises a conductive region 31, a conductive line 34, and a contact plug 44 which electrically connects the conductive line 34 to the conductive region 31. The conductive line 34 is electrically connected to the contact plug 44 through its side wall, the conductive region 31 is electrically connected to the contact plug 44 through its bottom, and the contact plug 44 gets gradually smaller in cross sectional area from its top to bottom. In this case, when the conductive region 31 formed under the plug 44 and the conductive line 34 formed on the upper side wall of the plug 44 are connected together with the contact plug 44, the contact plug 44 is formed in a self-aligned manner after the conductive line 34 is formed.