CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide an Al circuit board, in which a circuit board and a ceramic substrate are closely bonded to each other with a high bonding strength. SOLUTION: A ceramic circuit board is constituted by providing a circuit board having a surface made of a metal, composed mainly of alu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUGIMOTO ISAO, EMOTO HIDEYUKI, UTO MANABU, NONOGAKI RYOZO, IBUKIYAMA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!