CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide an Al circuit board, in which a circuit board and a ceramic substrate are closely bonded to each other with a high bonding strength. SOLUTION: A ceramic circuit board is constituted by providing a circuit board having a surface made of a metal, composed mainly of alu...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO ISAO, EMOTO HIDEYUKI, UTO MANABU, NONOGAKI RYOZO, IBUKIYAMA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an Al circuit board, in which a circuit board and a ceramic substrate are closely bonded to each other with a high bonding strength. SOLUTION: A ceramic circuit board is constituted by providing a circuit board having a surface made of a metal, composed mainly of aluminum on the side a ceramic substrate side on the ceramic substrate. The ceramic circuit board has a layer containing magnesium(Mg) and oxygen(O), preferably having a thickness of 2-20 nm, is provided adjacently to the ceramic substrate.