BRAZING FILLER METAL FOR ALUMINUM CIRCUIT SHEET AND CERAMIC CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide an inexpensive and highly reliable ceramic circuit board provided with an Al circuit sheet. SOLUTION: This brazing filler metal consists of an Al alloy containing 0.1-10 wt.% Sn and 0-5 wt.% Mg, and preferably, further contains at least one element selected from Si,...

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Bibliographische Detailangaben
Hauptverfasser:	EMOTO HIDEYUKI, OGATA YOICHI, NONOGAKI RYOZO, UTO MANABU, IBUKIYAMA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS REFRACTORIES SLAG SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF NATURAL STONE WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an inexpensive and highly reliable ceramic circuit board provided with an Al circuit sheet. SOLUTION: This brazing filler metal consists of an Al alloy containing 0.1-10 wt.% Sn and 0-5 wt.% Mg, and preferably, further contains at least one element selected from Si, Cu and Ge and is used for joining a ceramic substrate and a metal sheet consisting essentially of aluminum, together. This ceramic circuit board is manufactured by using the brazing filler metal.