SURFACE MOUNT TYPE RESIN-SEALED SEMICONDUCTOR DEVICE AND RESIN COMPOSITION THEREFOR

PROBLEM TO BE SOLVED: To provide a surface mount type resin-sealed semiconductor device having a small thermal stress caused by the difference of a linear expansion coefficient from that of a semiconductor element and excellent in reliability and to obtain a resin composition therefor. SOLUTION: The...

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Bibliographische Detailangaben
Hauptverfasser:	SEGAWA MASANORI, HOZOJI HIROYUKI, OGATA MASAJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a surface mount type resin-sealed semiconductor device having a small thermal stress caused by the difference of a linear expansion coefficient from that of a semiconductor element and excellent in reliability and to obtain a resin composition therefor. SOLUTION: The surface mount type resin-sealed semiconductor device is sealed with a resin composition comprising an epoxy resin and a quartz powder, where the quartz powder amounts at least 75 wt.% of the resin composition, at least 90 wt.% of the quartz powder having a particle size of 0.5-100 μm with an almost linear particle size distribution represented by an RRS particle size diagram and at least 60 wt.% of the quartz powder having a particle size of 20 μm or less, and the resin composition further contains a silicone polymer.