HIGH-FREQUENCY PACKAGE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To sufficiently secure isolation of plural high frequency input/output pins in a package. SOLUTION: A high-frequency package has slits 4 formed at a base of a package 1, which has plural high frequency input/output pins 2 and has a rectangular parallelepiped shape. The slits 4 are detached from the high-frequency input/output pins 2 by a length of about a quarter of a wavelength of a transmission high-frequency signal. The slits 4 can be detached from the high-frequency input/output pins 2 by the length which is an odd multiple of the quarter of the wavelength of the transmissions high-frequency signal.