BOARD FOR LASER CUTTING AND LIQUID CRYSTAL DISPLAY UNIT PANEL CONSTITUTED OF THE BOARD FOR LASER CUTTING

PROBLEM TO BE SOLVED: To provide a board for laser cutting, in which wiring can be cut finely with laser along a cut line, and a liquid crystal display unit panel constituted of the board for laser cutting. SOLUTION: A board for laser cutting contains a board, having an inner surface 142a and an out...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JEONG SEONG-WOOK, KIN HEIITSU, CHU DAE-HO, RI GUSHOKU, KIM BOM-SU
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CRYPTOGRAPHY CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS SEALS SIGNS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a board for laser cutting, in which wiring can be cut finely with laser along a cut line, and a liquid crystal display unit panel constituted of the board for laser cutting. SOLUTION: A board for laser cutting contains a board, having an inner surface 142a and an outer surface on which a cut line is shown, a wiring 146 of a conducting layer, which is formed along a corresponding cut line of the inner surface which line corresponds to the cut line of the outer surface of the board, and a buffer layer 144 which is interposed between the inner surface of the board and the wiring of the conducting layer along the cut line. In this board, the board and the buffer layer 144 are cut by irraduation of laser beams having different wavelengths, and the buffer layer 144 propagates crckes generated by an adjacent wiring.