MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE

MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: After a metal sheet 13 having an adhesive 14 is bonded to a lead portion 4 and resin sealed, leads are cut with a blade. Then, by peeling off th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OHIRO MASAHIKO, MARUO TETSUMASA, MATSUO TAKAHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: After a metal sheet 13 having an adhesive 14 is bonded to a lead portion 4 and resin sealed, leads are cut with a blade. Then, by peeling off the metal sheet 13 together with the adhesive 14, bent portions 12 (metal burrs) generated on the cut end surface of the lead portion 4 can be removed and a resin sealed semiconductor device wit high mounting reliability can be obtained.