DIELECTRIC CIRCUIT SUBSTRATE AND MM-WAVE SEMICONDUCTOR DEVICE INCLUDING THE SAME

PROBLEM TO BE SOLVED: To obtain a dielectric circuit substrate, where high-frequency characteristics are not affected by the amplification and propagation of resonance when a mm-wave semiconductor device is composed, and the mm-wave semiconductor device. SOLUTION: In the dielectric circuit substrate...

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Bibliographische Detailangaben
1. Verfasser:	KAKIMOTO NORIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a dielectric circuit substrate, where high-frequency characteristics are not affected by the amplification and propagation of resonance when a mm-wave semiconductor device is composed, and the mm-wave semiconductor device. SOLUTION: In the dielectric circuit substrate, via holes 6 for shielding electromagnetic waves are arranged so that they are not in a straight line at each side or are arranged at an unequal interval, thus allowing a resonance frequency to differ for each part and suppressing the amplification and propagation of resonance. Also, a distance L1 between the via holes 6 arranged mutually adjacent is preferably set to less than half the effective wavelength, thus reinforcing electromagnetic shielding.