SUBSTRATE COOLING DEVICE

PROBLEM TO BE SOLVED: To provide a substrate cooling device applied to a large amount production cooling device where a substrate is rapidly cooled an ion implantation, etc., is performed while the temperature of substrate is kept at minus. SOLUTION: A substrate 1 to be processed is fitted to a heat radiation plate 5 through a Peltier element 6 so that the heat of substrate is transferred to the heat radiation plate. Here, an electrostatic chuck 7 is provided in front of the Peltier element for attracting the substrate by static electricity. The Peltier element is sandwiched between the heat radiation plate and the electrostatic chuck through an elastic body, and a heat insulating bolt clamps the heat radiation plate 5 and the electrostatic chuck 7.