RESIN SEAL-TYPE SEMICONDUCTOR DEVICE AND RESIN COMPOSITION THEREFOR

PROBLEM TO BE SOLVED: To provide the subject semiconductor device low in thermal stress developing due to the difference in coefficient of linear expansion from the semiconductor element and excellent in sustained reliability, and to obtain the other subject resin composition therefor. SOLUTION: Thi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEGAWA MASANORI, HOZOJI HIROYUKI, OGATA MASAJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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