RESIN SEAL-TYPE SEMICONDUCTOR DEVICE AND RESIN COMPOSITION THEREFOR

RESIN SEAL-TYPE SEMICONDUCTOR DEVICE AND RESIN COMPOSITION THEREFOR

PROBLEM TO BE SOLVED: To provide the subject semiconductor device low in thermal stress developing due to the difference in coefficient of linear expansion from the semiconductor element and excellent in sustained reliability, and to obtain the other subject resin composition therefor. SOLUTION: Thi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SEGAWA MASANORI, HOZOJI HIROYUKI, OGATA MASAJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide the subject semiconductor device low in thermal stress developing due to the difference in coefficient of linear expansion from the semiconductor element and excellent in sustained reliability, and to obtain the other subject resin composition therefor. SOLUTION: This resin composition comprises a resin (consisting mainly of an epoxy resin and also containing a silicone polymer) and >=75 wt.% of silica powder; wherein a >=90 wt.% equivalent of the silica powder has a particle size of 0.5-100 μm, having such a distribution as to be shown by nearly a straight line when represented with an RRS particle size diagram and/or a >=60 wt.% equivalent of the silica powder has a particle size of