MANUFACTURE OF PLATING ELECTRONIC TERMINATION

PROBLEM TO BE SOLVED: To improve solderability by covering a metal lead wire/termination with a film and flattening it until the thickness of a covering film for the metal lead wire/termination becomes a specific thickness so that the covered lead wire is substantially smoothened and the porosity ma...

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Bibliographische Detailangaben
Hauptverfasser:	KWOKA MARK, LINN JACK
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LINE CONNECTORS MACHINE TOOLS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PUNCHING METAL SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve solderability by covering a metal lead wire/termination with a film and flattening it until the thickness of a covering film for the metal lead wire/termination becomes a specific thickness so that the covered lead wire is substantially smoothened and the porosity may be substantially reduced. SOLUTION: A lead wire for an electronic device, especially a lead wire in an integrated circuit, is flattened so that its covering thickness may substantially be about 0.1 to 10%, thereby improving the solderability of the lead wire. The flattening is realized by rolling, stamping, peening, coining, or forging. Thus, the flattening of the covering film of the lead wire can reduce the porosity of the surface, minimize the entire surface area, and eliminate a work required for wetting the surface of the lead wire/termination. In addition, an influence due to non-quality ridge and groove can be prevented by flattening the covering film, and an excellent solderability can be obtained.