THERMOFORMING MULTILAYERED STRUCTURE AND THERMOFORMED CONTAINER

PROBLEM TO BE SOLVED: To prevent a crack, a pinhole, local thickness, irregularity, etc., while obtaining high gas barrier properties by laminating a specific ethylene/vinyl alcohol copolymer resin layer and a polypropylene resin layer wherein an isotactic bond is a specific ratio through an adhesiv...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HAYASHI NAHOTOSHI, SHIMO HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent a crack, a pinhole, local thickness, irregularity, etc., while obtaining high gas barrier properties by laminating a specific ethylene/vinyl alcohol copolymer resin layer and a polypropylene resin layer wherein an isotactic bond is a specific ratio through an adhesive resin layer. SOLUTION: An ethylene/vinyl alcohol copolymer resin (EVOH resin) A layer with an ethylene content of 20-60 mol% and a saponification value of 90% or more and a polypropylene resin (PP resin) C layer wherein an isotactic bond is 95% or more in pentad display are laminated through an adhesive resin B layer. As the EVOH resin, a resin compsn. comprising two or more kinds of ethylene/vinyl alcohol copolymers having different melting points is pref. As the adhesive resin B, a carboxylic acid modified polyolefinic resin is pref. from a viewpoint of adhesiveness. The PP resin C pref. has a melt flow rate at 230 deg.C under load of 2.160 g of 0.1-100 g/10 min.