SURFACE FLATTENING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of repairing a surface recess produced on the metal part of a semiconductor device by a dishing phenomenon when a CMP (chemical mechanical polishing) process is carried out so as to uniformly flatten all the surface of the semiconductor device. SOLUTION: The...

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Bibliographische Detailangaben

1. Verfasser:	KOGURE NAOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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