JIG AND METHOD FOR PLATING MAGNETIC HEAD WAFER

PROBLEM TO BE SOLVED: To realize a jig and method capable of uniform plating thickness for a magnetic head wafer. SOLUTION: The jig 30 for plating a magnetic head wafer is such that the magnetic head wafer 21 can be loaded on it and that it is equipped with a main electrode for flowing a plating cur...

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1. Verfasser:	YAMAZAKI FUMIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To realize a jig and method capable of uniform plating thickness for a magnetic head wafer. SOLUTION: The jig 30 for plating a magnetic head wafer is such that the magnetic head wafer 21 can be loaded on it and that it is equipped with a main electrode for flowing a plating current to the wafer 21 and with a ring- shaped auxiliary electrode 34 which is arranged to enclose the wafer 21 and which is connected to a plating power source. In this case, the ring-shaped auxiliary electrode 34 is designed to be divided into plural pieces in a circumferential direction.