BALL SUCTION HEAD

PROBLEM TO BE SOLVED: To enable a small-sized low-capacity evacuating means to evenly suck balls by movably providing a mask which sets a position at which sucking forces are applied to prescribed ball sucking holes and another position at which no sucking force is applied to the holes in a ball suc...

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Bibliographische Detailangaben
1. Verfasser:	KOBAYASHI TATSUHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable a small-sized low-capacity evacuating means to evenly suck balls by movably providing a mask which sets a position at which sucking forces are applied to prescribed ball sucking holes and another position at which no sucking force is applied to the holes in a ball suction head. SOLUTION: A suction plate 3 having many ball sucking holes 2 is mounted on the lower surface of a ball suction head 1, and the half of the ball sucking holes 2 of the plate 3 are closed by lowering a mask 4 on the internal side face of the plate 3 by means of an air cylinder 5. In this state, solder balls 7 are sucked to the ball sucking holes 2 of the plate 3 which are not closed by the mask 4 by evacuating the air in the head 1 by means of an evacuating source 16 connected to a suction passage 6. Therefore, the ball sucking efficiencies of the ball sucking holes 2 to which sucking forces are applied can be improved and the holes 2 can be made to evenly suck the solder balls 7.