MOUNTING DEVICE FOR ELECTRONIC PART

PROBLEM TO BE SOLVED: To hold valid strength, and to increase solder bonding performance. SOLUTION: An electric part 2 such as a BGA is mounted on a wiring board 5, the electronic part 2 is provided with plural solder electrodes 3(3-1, 3-2) arranged like a square matrix on its back face, and the wiring board 5 is provided with plural lands 6(6-1, 6-2) on its surface side. In this case, the plural solder electrodes 3 and the plural lands 6 are arranged so as to be positioned corresponding to each other, and the three solder electrodes 3-2 among the four solder electrodes 3 at the corner of the electric part 2 are solder-bonded corresponding to one land 6-2. The land is included in a diagonal region, and the valid strength can be held, and the solder bonding performance can be increased.