CERAMICS CIRCUIT BOARD

CERAMICS CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. T...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUGIMOTO ISAO, OGATA YOICHI, NONOGAKI RYOZO, UTO MANABU, IBUKIYAMA MASAHIRO
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SUGIMOTO ISAO
OGATA YOICHI
NONOGAKI RYOZO
UTO MANABU
IBUKIYAMA MASAHIRO
description PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. The Al plate is bonded to the ceramics board via moreover an Al alloy, wherein Mg and further at least one among Si, Ge and Cu are contained and the temperature generating liquid phase is 500-630 deg.C.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2001053405A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2001053405A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2001053405A3</originalsourceid><addsrcrecordid>eNrjZBBzdg1y9PV0DlZw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGhgamxiYGpo7GRCkCAOHdH1s</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CERAMICS CIRCUIT BOARD</title><source>esp@cenet</source><creator>SUGIMOTO ISAO ; OGATA YOICHI ; NONOGAKI RYOZO ; UTO MANABU ; IBUKIYAMA MASAHIRO</creator><creatorcontrib>SUGIMOTO ISAO ; OGATA YOICHI ; NONOGAKI RYOZO ; UTO MANABU ; IBUKIYAMA MASAHIRO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. The Al plate is bonded to the ceramics board via moreover an Al alloy, wherein Mg and further at least one among Si, Ge and Cu are contained and the temperature generating liquid phase is 500-630 deg.C.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010223&amp;DB=EPODOC&amp;CC=JP&amp;NR=2001053405A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20010223&amp;DB=EPODOC&amp;CC=JP&amp;NR=2001053405A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGIMOTO ISAO</creatorcontrib><creatorcontrib>OGATA YOICHI</creatorcontrib><creatorcontrib>NONOGAKI RYOZO</creatorcontrib><creatorcontrib>UTO MANABU</creatorcontrib><creatorcontrib>IBUKIYAMA MASAHIRO</creatorcontrib><title>CERAMICS CIRCUIT BOARD</title><description>PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. The Al plate is bonded to the ceramics board via moreover an Al alloy, wherein Mg and further at least one among Si, Ge and Cu are contained and the temperature generating liquid phase is 500-630 deg.C.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBzdg1y9PV0DlZw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGhgamxiYGpo7GRCkCAOHdH1s</recordid><startdate>20010223</startdate><enddate>20010223</enddate><creator>SUGIMOTO ISAO</creator><creator>OGATA YOICHI</creator><creator>NONOGAKI RYOZO</creator><creator>UTO MANABU</creator><creator>IBUKIYAMA MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20010223</creationdate><title>CERAMICS CIRCUIT BOARD</title><author>SUGIMOTO ISAO ; OGATA YOICHI ; NONOGAKI RYOZO ; UTO MANABU ; IBUKIYAMA MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001053405A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGIMOTO ISAO</creatorcontrib><creatorcontrib>OGATA YOICHI</creatorcontrib><creatorcontrib>NONOGAKI RYOZO</creatorcontrib><creatorcontrib>UTO MANABU</creatorcontrib><creatorcontrib>IBUKIYAMA MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGIMOTO ISAO</au><au>OGATA YOICHI</au><au>NONOGAKI RYOZO</au><au>UTO MANABU</au><au>IBUKIYAMA MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CERAMICS CIRCUIT BOARD</title><date>2001-02-23</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To provide a ceramics circuit board with high reliability. SOLUTION: In this ceramics circuit board, an Al plate is bonded to at least one main surface of a ceramics board. Purity of the Al plate is at least 99.0 wt.% and at most 99.95 wt.%. The ceramics board is made of LlN. The Al plate is bonded to the ceramics board via moreover an Al alloy, wherein Mg and further at least one among Si, Ge and Cu are contained and the temperature generating liquid phase is 500-630 deg.C.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2001053405A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CERAMICS CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T02%3A09%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUGIMOTO%20ISAO&rft.date=2001-02-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2001053405A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true